Multilayer ceramic substrate-technology for VLSI package/multichip module [Latin Book]
Otsuka,Kanji
| Record Identifier: | 2430 |
| Class: | .C4,O8813 1993 TK 7871.15 |
| Title: | Multilayer ceramic substrate-technology for VLSI package/multichip module |
| Authorstatement: | Otsuka,Kanji |
| Subject: | Electronic ceramics Electronic ceramics |
| Subject: | Electronic packaging--Materials Electronic packaging--Materials |
| Subject: | Intergrated circuts--Very large scale integration--Design and construction Intergrated circuts--Very large scale integration--Design and construction |
| Subject: | Aluminum oxide Aluminum oxide |
| Title: | Seramikku tas o haisen kiban.English Seramikku tas o haisen kiban.English |
| Publisher: | London London,1993,1993,Elsevier applied science,Elsevier applied science |
| Publish place: | London London |
| Publisher: | Elsevier applied science Elsevier applied science |
| Publish Date: | 1993 1993 |
| Register Number | Version | Volume | Part | Reference | Call Number | lended | Date Back | Description | |
|---|---|---|---|---|---|---|---|---|---|
| 1568 | 1 | 0 |
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